The MediaTek Dimensity 7300 series chipsets were unveiled by the company on Thursday. The Taiwan-based semiconductor giant introduced the Dimensity 7300 and Dimensity 7300X chipsets with advanced AI computing capabilities and a focus on multitasking. It is built on TSMC's advanced third-generation 4nm process technology and offers up to 25 percent lower power consumption compared to the Dimensity 7050 SoC. In particular, the company said that the Dimensity 7300X it was designed with stylish foldable smartphones in mind and can support dual displays.
The new chipsets have an octa-core CPU consisting of four 2.5GHz Arm Cortex-A78 cores and four Arm Cortex-A55 efficiency cores, according to MediaTek's press release. The CPU is paired with the Arm Mali-G615 GPU and MediaTek's HyperEngine optimizations. The company says the combination is aimed at improving gaming experiences on smartphones.
Additionally, these chipsets are also built with optimizations for resource usage, 5G connectivity, and Wi-Fi gaming connections. Dimensity 7300 chipsets support Bluetooth LE audio technology and Dual-Link True Wireless Stereo (TWS) audio.
In terms of image processing, the chipsets also include the MediaTek Imagiq 950 ISP, which includes a 12-bit HDR ISP and supports a primary camera of up to 200 megapixels. The hardware engines also feature multi-channel noise reduction (MCNR), HWFD (hardware face detection), and HDR video capabilities. The company says these improvements will allow users to capture brilliant photos and videos in any lighting condition.
Compared to its predecessor, the Live Focus photo performance function is up to 1.3 times faster, while photo remastering is up to 1.5 times faster. The Dimensity 7300 chips also allow users to record 4K HDR videos with a dynamic range more than 50 percent wider compared to competitors in the segment, MediaTek claimed. This update is said to show more detail in videos.
For AI computing, the chipsets carry the MediaTek 655 APU (Agent Processing Unit) which is said to increase the efficiency of AI tasks. The APU can also accommodate mixed precision data types. This is said to help with better memory bandwidth utilization and reduced memory requirements for larger AI models. The company did not highlight the size of the parameter that the APU can handle.
In terms of connectivity, MediaTek Dimensity 7300 chipsets offer 13 to 30 percent better power efficiency on sub-6GHz 5G connections. It supports up to 3.27 Gb per second 5G downlink using 3CC carrier aggregation. This will enable the chipset to offer faster downlinks in urban and suburban regions. Additionally, the chipsets support dual SIM 5G along with dual VoNR (Voice over New Radio) as well as tri-band Wi-Fi 6E.
